Job Description

Job Description: PCB Layout Engineer
Role Overview
We are looking for a PCB Layout Engineer to design and implement high-speed high-
density printed circuit boards for next-generation adaptive compute and
communication platforms.
This role focuses on complex multilayer PCB layout signal/power integrity and
manufacturability ensuring robust performance for systems involving SoCs FPGAs RF
modules and high-speed interfaces.

Key Responsibilities
1. PCB Layout Design
Design multi-layer (8 20 layers) high-speed PCBs
Execute component placement routing and stack-up definition
Work on boards involving:
o SoCs FPGAs CPUs/GPUs
o DDR memory high-speed SerDes interfaces
Ensure compliance with design rules and constraints

2. High-Speed Signal Routing
Route high-speed interfaces such as:
o DDR3/DDR4/DDR5 PCIe USB Ethernet MIPI
Maintain:
o Controlled impedance
o Length matching and timing constraints
Address issues like:
o Crosstalk reflections signal loss

3. Power Integrity & Grounding
Design robust power distribution networks (PDN)
Optimize:
o Decoupling strategies
o Power planes and return paths

Work closely with power and SI/PI teams

4. SI/PI & EMI/EMC Considerations
Collaborate on:
o Signal Integrity (SI) and Power Integrity (PI) analysis
Ensure compliance with:
o EMI/EMC guidelines
Implement shielding filtering and isolation techniques

5. Design for Manufacturability (DFM) & Assembly (DFA)
Ensure layouts meet:
o Fabrication and assembly guidelines
Work with vendors for:
o PCB fabrication and stack-up optimization
Generate outputs:
o Gerber files ODB fabrication drawings

6. Cross-Functional Collaboration
Work with:
o Hardware design RF and mechanical teams
o Thermal and manufacturing teams
Participate in:
o Design reviews and layout sign-offs

Required Skills & Qualifications
Education
/ Diploma in Electronics / Electrical / Communication
Experience
3 10 years in PCB Layout Design (high-speed boards preferred)

Technical Skills

Strong expertise in PCB design tools:
o Cadence Allegro / OrCAD / Mentor Graphics (Expedition PADS)
Good understanding of:
o High-speed routing and constraints
o Stack-up design and impedance control
o SI/PI fundamentals
Experience with:
o Multi-layer boards and HDI design
Familiarity with:
o IPC standards (IPC-2221 IPC-7351)

Preferred Skills
Experience in:
o Adaptive compute platforms (FPGA/ASIC-based systems)
Exposure to:
o RF PCB layout considerations
o Automotive or telecom hardware
Knowledge of:
o Thermal design and mechanical constraints

Behavioral Competencies
Strong attention to detail
Problem-solving and debugging mindset
Ability to work in fast-paced cross-functional teams
Effective communication skills

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